FPC-8108W-G1

Ruggedized Edge AI computing Box PC with Intel^® 10th Gen. Core i9/i7/i5/i3 Supporting NVIDIA 150W GPU

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사양

CPU	Intel^® 10th generation Core™ i9 / i7 / i5 / i3 processor in LGA1200 socket
Memory	2 x 260-pin DDR4 SO-DIMM sockets, supporting 2933 MHz SDRAM up to 64GB
Chipset	Intel^® W480E
Graphics	Integrated Intel^® HD Graphics
ATA	2 x Serial ATA ports with 600MB/s HDD transfer rate
LAN Chipset	1 x Intel^® WGI225LM 2.5GbE LAN 1 x Intel^® WGI211AT GbE controller 1 x Intel^® WGI219LM GbE controller w/ iAMT 14.0
Watchdog Timer	1~255 levels reset

Serial Port	2 x RS-232 / 422 / 485 configurable via DB-9 connectors 4 x RS-232 ports via DB-9 connectors
USB Port	2 x USB 3.2 Gen2 / 2.0 ports 4 x USB 3.2 Gen1 / 2.0 ports 2 x USB 2.0 ports Internal USB dongle (Optional)
LAN	3 x RJ-45 ports for GbE / 2.5GbE
Video Port	1 x HDMI 1 x DB-15 female connector for Analog RGB 1 x DVI-D female connector for digital video output * Support 3 independent displays
Expansion Bus	1 full-size Mini-card interconnected with SIM card for optional Wi-Fi / 3G / 4G / GPS or I/O Expansion (PCIe x1 + USB2.0) 1 x M.2 E key (2230) with PCIe x1 + USB2.0, for Wireless 1 x M.2 B key (2242 / 3052 / 2280) w/ (PCIe x2 + USB3.0 + SATA) interconnected with SIM for 5G / LTE expansion or for storage (either one) 3 x PCIe x4 slots 1 x PCIe x16 slot (via x8 lanes) Support up to 150W GPU
Selectable Port	1 x DB25 connector for DIO (8 in / 8 out) port or LPT port (either one, default is DIO)
Audio	Mic-in / Line-out

Operating Temp.	-20 ~ 70°C (-4 ~ 158°F), ambient w/ air flow, (w/ 35W TDP CPU, fanless) -20 ~ 55°C (-4 ~ 131°F), ambient w/ air flow, (w/ 65W TDP CPU, fanless) -20 ~ 45°C (-4 ~ 112°F), w/ GTX-1660 GPU
Storage Temp.	-40 ~ 85°C (-40 ~ 185°F)
Operating Humidity	10 ~ 95% @ 70°C (non-condensing)
Vibration	3 Grms / 5~500Hz / random operation w/ SSD
Shock	Operating 40G (11ms), Non-operating 60G with SSD

System	Windows 10 IOT Enterprise 64-bit Linux (Kernel: 4.9)

Type	2 x 2.5” drive bays 1 x CFast socket, can be outside accessible

Certification	CE, FCC Class A

Power Input	DC 9 ~ 36V input Max. 16A/300W (w/ 4-pin DC input terminal block, combining remote power on/off switch)
Ignition Switch	2-pin terminal block: IGN, GND
Power Consumption	MAX. 65W (w/35W TDP CPU, w/o I/O card) MAX. 95W (w/65W TDP CPU, w/o I/O card)

FPC-8108W-G1	Ruggedized Edge AI commputing Box PC with Intel^® 10th Gen CoreTM i9 / i7 / i5 / i3 w/ expansion fan and PEG 8-pin power cable, supporting NVIDIA^® 150W GPU

액세서리

240GB SSD
Intel^® 2.5” 240GB SATA III SSD kit
WiFi-IN2550
Intel^® AX200NGW M.2 Wi-Fi 6 module w/ 2 x 30cm internal wires
ANT-D11
1 x Wi-Fi Dual-band 2.4G/5G antenna
ANT-H11
2dBi HSUPA Antenna Kit
Core™ i9-10900E
Intel^® 10th Gen. Core™ i9-10900E processor, L2/20M, 2.8G
Core™ i9-10900TE
Intel^® 10th Gen. Core™ i9-10900TE processor, L2/20M, 1.8G
Core™ i7-10700E
Intel^® 10th Gen. Core™ i7-10700E processor, L2/16M, 2.9G
Core™ i7-10700TE
Intel^® 10th Gen. Core™ i7-10700TE processor, L2/16M, 2.0G
Core™ i5-10500E
Intel^® 10th Gen. Core™ i5-10500E processor, L2/12M, 3.1G
Core™ i5-10500TE
Intel^® 10th Gen. Core™ i5-10500TE processor, L2/12M, 2.3G
Core™ i3-10100E
Intel^® 10th Gen. Core™ i3-10100E processor, L2/6M, 3.2G
Core™ i3-10100TE
Intel^® 10th Gen. Core™ i3-10100TE processor, L2/6M, 2.3G
MK-4C-4G / 8G / 16G / 32G
DDR4-2400 4GB / 8GB / 16GB / 32GB (DDR4-2933) SDRAM DIMM kit
MK-4I-4G / 8G / 16G / 32G
WT, DDR4-2400 4GB / 8GB / 16GB / 32GB (DDR4-2933) SDRAM DIMM kit

*CTOS means Configure-to-Order Service.

다운로드

설명	사이즈	유형	버전	날짜	다운로드
설명 FPC-8108W-G1 Datasheet	사이즈 967 KB	유형 pdf	버전	날짜 2022-01-25	다운로드 다운로드
설명 FPC-8108W-G1/ 8109-G1 Series Manual	사이즈 -	유형 pdf	버전 V1.0	날짜 2022-08-31	다운로드 다운로드