FPC-8108W-G1

NVIDIA GTX-16 シリーズ最大 150W GPU をサポート

FPC-8108W-G1

NVIDIA GTX-16 シリーズ最大 150W GPU をサポート
主な特長
  • Intel® OpenVINO™ ツールキット対応
  • NVIDIA GTX-16 シリーズ最大 150W GPU をサポート
  • 広範囲のDC電源入力(9~36V)
  • 3つの独立したディスプレイをサポート (HDMI x 1 + VGA x 1 および DVI-D x 1)
  • 電源オン/オフ遅延制御 / 設定可能な点火電力制御
  • TPM 2.0のサポート
  • オプションの Wi-Fi / 3G / 4G / GPS または I/O 拡張用の 1x mPCIe をサポート
  • Wi-Fi / BT 用 M.2 E キー (2230) 1 個
  • 1 x M.2 (NGFF) B-Key(2242 / 3052 / 2280)ソケット(ストレージまたは 5G / LTE 用)
  • 前面からアクセス可能な I/O
  • RAID 0、1をサポート
比較リストに追加
仕様

System

CPU Intel® 10th generation Core™ i9 / i7 / i5 / i3 processor in LGA1200 socket
Memory 2 x 260-pin DDR4 SO-DIMM sockets, supporting 2933 MHz SDRAM up to 64GB
Chipset Intel® W480E
Graphics Integrated Intel® HD Graphics
ATA 2 x Serial ATA ports with 600MB/s HDD transfer rate
LAN Chipset 1 x Intel® WGI225LM 2.5GbE LAN
1 x Intel® WGI211AT GbE controller
1 x Intel® WGI219LM GbE controller w/ iAMT 14.0
Watchdog Timer 1~255 levels reset

I/O Interface

Serial Port 2 x RS-232 / 422 / 485 configurable via DB-9 connectors
4 x RS-232 ports via DB-9 connectors
USB Port 2 x USB 3.2 Gen2 / 2.0 ports
4 x USB 3.2 Gen1 / 2.0 ports
2 x USB 2.0 ports
Internal USB dongle (Optional)
LAN 3 x RJ-45 ports for GbE / 2.5GbE
Video Port 1 x HDMI
1 x DB-15 female connector for Analog RGB
1 x DVI-D female connector for digital video output
* Support 3 independent displays
Expansion Bus 1 full-size Mini-card interconnected with SIM card for optional Wi-Fi / 3G / 4G / GPS or I/O Expansion (PCIe x1 + USB2.0)
1 x M.2 E key (2230) with PCIe x1 + USB2.0, for Wireless
1 x M.2 B key (2242 / 3052 / 2280) w/ (PCIe x2 + USB3.0 + SATA) interconnected with SIM for 5G / LTE expansion or for storage (either one)
3 x PCIe x4 slots
1 x PCIe x16 slot (via x8 lanes)
Support up to 150W GPU
Selectable Port 1 x DB25 connector for DIO (8 in / 8 out) port or LPT port (either one, default is DIO)
Audio Mic-in / Line-out

Environmental

Operating Temp. -20 ~ 70°C (-4 ~ 158°F), ambient w/ air flow, (w/ 35W TDP CPU, fanless)
-20 ~ 55°C (-4 ~ 131°F), ambient w/ air flow, (w/ 65W TDP CPU, fanless)
-20 ~ 45°C (-4 ~ 112°F), w/ GTX-1660 GPU
Storage Temp. -40 ~ 85°C (-40 ~ 185°F)
Operating Humidity 10 ~ 95% @ 70°C (non-condensing)
Vibration 3 Grms / 5~500Hz / random operation w/ SSD
Shock Operating 40G (11ms), Non-operating 60G with SSD

OS Support

System Windows 10 IOT Enterprise 64-bit
Linux (Kernel: 4.9)

Storage

Type 2 x 2.5” drive bays
1 x CFast socket, can be outside accessible

Qualification

Certification CE, FCC Class A

Power Requirement

Power Input DC 9 ~ 36V input Max. 16A/300W (w/ 4-pin DC input terminal block, combining remote power on/off switch)
Ignition Switch 2-pin terminal block: IGN, GND
Power Consumption MAX. 65W (w/35W TDP CPU, w/o I/O card)
MAX. 95W (w/65W TDP CPU, w/o I/O card)

Mechanical

Construction Aluminum Alloy
Mounting Wall-mount
Weight 7.35kg (16.20Ib)
Dimensions (W x D x H) 225 x 292 x 190 mm (8.86" x 11.50" x 7.48")

Ordering Information

FPC-8108W-G1 Ruggedized Edge AI commputing Box PC with Intel® 10th Gen CoreTM i9 / i7 / i5 / i3 w/ expansion fan and PEG 8-pin power cable, supporting NVIDIA® 150W GPU
アクセサリー

Optional Accessories

  • PAC-120W6B-FSP
    120W AC/DC adapter kit w/ 2-pin / 3-pin / 4-pin block
  • PAC-180W6C-FSP
    180W AC/DC adapter kit w/ 2-pin / 3-pin / 4-pin block
  • PAC-280W6C-MW
    280W AC/DC 24V adapter kit w/ 2-pin/3-pin/4-pin block
  • WMK-7000
    Wall-mount kit for FPC-7XXX Series

Optional Configuration (*CTOS Kit)

  • 240GB SSD
    Intel® 2.5” 240GB SATA III SSD kit
  • WiFi-IN2550
    Intel® AX200NGW M.2 Wi-Fi 6 module w/ 2 x 30cm internal wires
  • ANT-D11
    1 x Wi-Fi Dual-band 2.4G/5G antenna
  • ANT-H11
    2dBi HSUPA Antenna Kit
  • Core™ i9-10900E
    Intel® 10th Gen. Core™ i9-10900E processor, L2/20M, 2.8G
  • Core™ i9-10900TE
    Intel® 10th Gen. Core™ i9-10900TE processor, L2/20M, 1.8G
  • Core™ i7-10700E
    Intel® 10th Gen. Core™ i7-10700E processor, L2/16M, 2.9G
  • Core™ i7-10700TE
    Intel® 10th Gen. Core™ i7-10700TE processor, L2/16M, 2.0G
  • Core™ i5-10500E
    Intel® 10th Gen. Core™ i5-10500E processor, L2/12M, 3.1G
  • Core™ i5-10500TE
    Intel® 10th Gen. Core™ i5-10500TE processor, L2/12M, 2.3G
  • Core™ i3-10100E
    Intel® 10th Gen. Core™ i3-10100E processor, L2/6M, 3.2G
  • Core™ i3-10100TE
    Intel® 10th Gen. Core™ i3-10100TE processor, L2/6M, 2.3G
  • MK-4C-4G / 8G / 16G / 32G
    DDR4-2400 4GB / 8GB / 16GB / 32GB (DDR4-2933) SDRAM DIMM kit
  • MK-4I-4G / 8G / 16G / 32G
    WT, DDR4-2400 4GB / 8GB / 16GB / 32GB (DDR4-2933) SDRAM DIMM kit
*CTOS means Configure-to-Order Service.
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説明 サイズ 種類 バージョン 日付 ダウンロード
説明
サイズ
967 KB
種類
pdf
バージョン
日付
2022-01-25
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説明
サイズ
-
種類
pdf
バージョン
V1.0
日付
2022-08-31
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