EmETXe-i2309
Carte mère, UC COM EXPRESS® TYPE 6 Compact - Intel® Atom™ E3845
EmETXe-i2309
Carte mère, UC COM EXPRESS® TYPE 6 Compact - Intel® Atom™ E3845
Caractéristiques
- Conception sans ventilateur
- Processeur embarqué Intel® Atom™ Processor E3845
- 1 x GbE
- 1 x Double Canal 24-bit LVDS, 1 x RGB Analogique, 1 x DisplayPort
- Température de fonctionnement étendue .: -20 / + 70°C
- Large plage de température pour série WT : -40 / +85°C
Spécification
System
| CPU | Soldered onboard Intel® Atom™ processor E3845 1.91GHz |
|---|---|
| Memory | 1 x DDR3L SO-DIMM socket, supporting up to 8GB 1333MT/s SDRAM |
| BIOS | Insyde UEFI BIOS |
| Watchdog Timer | 1~255 levels reset |
I/O Interface
| USB Port | 8 x USB 2.0 ports (USB port 0~3 support USB2.0 only, USB port 4~7 work after driver installation)
1 x USB 3.0 port |
|---|---|
| Expansion Bus | 8 x PCIex1 lanes SPI, LPC, SM_BUS, GPIO(Optional) |
| Storage | 2 x Serial ATA ports with 300MB/s HDD transfer rate Soldered onboard 8GB eMMC 4.5 (OEM Request) |
| Ethernet Chipset | 1 x Intel® Ethernet controller i210x series |
| Serial Port | 1 x UART (RX/TX) |
| Audio | HD audio link |
| TPM | Supports TPM (OEM Request) |
Mechanical & Environmental
| Power Requirement | +12V, 5VSB |
|---|---|
| Power Consumption | 1.05A@+12V (Typical) |
| Operating Temp. | -20 ~ 70°C (-4 ~ 158°F) -40 ~ 85°C (-40 ~ 185°F, WT series) |
| Operating Humidity | 10 ~ 95% @ 70ºC (non-condensing) 10 ~ 95% @ 85ºC (non-condensing, WT series) |
| Dimension (L x W) | 95 x 95 mm (3.7” x 3.7”) |
Display
| Graphics Chipset | SoC integrated Intel® Gen7 Graphics |
|---|---|
| Graphics Interface | 24-bit Dual Channels LVDS supported via eDP to LVDS NXP PTN3460 1 x DisplayPort Analog RGB supported |
OS support
| Windows 7 32-bit/64-bit Windows 8 32-bit/64-bit Windows 10 IoT Linux: Ubuntu |
Ordering Information
| EmETXe-i2309-E3845 | Intel® Atom™ processor E3845 1.91GHz COM Express® Compact CPU module, w/ SDIO |
|---|---|
| EmETXe-i2309-WT-E3845 | Wide range temperature Intel® Atom™ processor E3845 1.91GHz WT COM Express® Compact CPU module |
| EmETXe-i2309-E3845-DIO | Intel® Atom™ processor E3845 1.91GHz COM Express® Compact CPU module,w/ GPIO |
Accessoires
Optional Accessories
| HS-2309-F2-NT* | Heat spreader without threaded standoffs 95x95x11mm, not compatible with WT series |
|---|---|
| HS-0000-W4 | Universal evaluation heat sink kit with thermal pad 125x95x22mm, only used on a flat-type heat spreader |
| PBE-1705-F1 | COM Express® Type 6 evaluation carrier board in ATX form factor |
| CBK-03-1705-00 | Cable kit 2 x COM Flat cables 1 x SATA cable |
Télécharger
| Description | Taille | Type | Version | Date | Télécharger |
|---|---|---|---|---|---|
|
Description
|
Taille
1 MB
|
Type
pdf
|
Version
|
Date
2022-10-18
|
Télécharger
|
|
Description
|
Taille
1 MB
|
Type
pdf
|
Version
V2.0
|
Date
2022-10-12
|
Télécharger
|
|
Description
|
Taille
4 MB
|
Type
pdf
|
Version
V2.0
|
Date
2022-10-12
|
Télécharger
|
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EmETXe-i2309
EmETXe-i2309